Amphenol's XPO OverPass™ Assembly is designed to unlock the full performance potential of next-generation 12.8 Tb/s XPO-LPO optical transceivers. Delivering 4× the front I/O signal density of traditional OSFP modules, the solution enables hyperscale and AI infrastructure to scale bandwidth without sacrificing signal integrity or routing flexibility. The XPO OverPass™ Assembly provides the high-speed mating interface between the XPO pluggable transceiver and system architecture, efficiently routing 64 high-speed lanes directly to the chip (NPC/CPC) or to the backplane. Using 30 AWG or 32 AWG OverPass™ cable assemblies, the design supports flexible routing while maintaining reliable high-speed performance across demanding data center environments

Engineered for Open Compute Project (OCP) architectures and next-generation AI clusters, the XPO OverPass™ assembly enables scalable front-panel bandwidth and supports up to 204.8 Tb/s of front I/O density per OCP rack. With compatibility across Amphenol's high-performance backplane portfolio, including UltraPass™, UltraPass™ XR, UltraPass™ HD, XtremePass™, and Paladin® HD2 backplane connectors, the solution provides system designers with the flexibility needed to build high-density, high-performance platforms.

• Maximizes the value of 12.8 Tb/s XPO-LPO optical pluggable transceiver
• Reliably connects the XPO-LPO transceiver to the chip (NPC/CPC) or backplane
• Provides routing flexibility by 30 and 32 gauge wire options
• Enables front I/O density to 204.8 Tb/s per OCP rack