Introduction to CPO Technology - Achieving Low Energy Consumption and High Energy Efficiency in High Computing Power Scenarios.

CPO technology, also known as Co packaged optics, stands for co packaged optics and is an innovative packaging technology. It tightly integrates the switching chip and the optical engine, and assembles them together on the same Socket, achieving co packaging of the chip and module. This design not only effectively solves the problem of excessive number of optical modules in ultra-high computing power environments, but also significantly shortens the distance between the switching chip and the optical module, ensuring high-quality transmission of high-speed electrical signals between the two. By combining energy-saving solutions such as liquid cooling plate cooling, CPO technology can achieve excellent performance with low energy consumption and high energy efficiency in high computing scenarios. Compared with traditional connection methods such as Pluggable and NPO stages, CPO undoubtedly represents the ultimate solution, while NPO can be seen as a necessary transition towards CPO evolution.

The core of CPO technology lies in its reliance on silicon photonics technology. Silicon photonics, a silicon-based optoelectronic large-scale integration technology that uses photons and electrons as information carriers, aims to highly integrate numerous optical devices on a silicon-based substrate, thereby constructing miniaturized optical systems. This technology not only enhances the integration of the system, but also helps to reduce costs and energy consumption, providing strong support for high-speed and high-capacity optical communication.
Several well-known companies have emerged in the CPO concept stocks. For example, as a leading global provider of optical module solutions, Zhongji Xuchuang has demonstrated outstanding performance in 800G product technology, leading the way in mass production progress and successfully occupying a major market share. In addition, companies such as Xin Yisheng, Guangxun Technology, and Cambridge Technology have also demonstrated strong strength and potential in their respective fields.
It is worth noting that the widespread application of CPO technology will bring revolutionary changes to the entire optical communication industry. It is not only expected to solve the problem of excessive number of optical modules in ultra-high computing power environments, but also significantly improve the energy efficiency and transmission speed of the system. Therefore, for enterprises pursuing high-performance and low-energy optical communication solutions, CPO technology is undoubtedly a rare opportunity.
The company's high-speed optical module products mainly serve telecommunications operators and data center operators, covering backbone transmission of carrier networks, metropolitan area networks and access networks, as well as efficient interconnection of data centers. The company has performed particularly well in the international market, with foreign business accounting for as much as 72%, and has partnered with Google, Microsoft META、 Amazon and other well-known North American supercomputing companies maintain close cooperative relationships, and their high-speed optical module products have been successfully shipped to three of them, one of which has achieved large-scale shipment. At the 2023 OFC conference, the company showcased its latest 800G optical modules and 1.6T related technologies, providing strong support for customers' 51.2T level switching needs. In addition, the company will focus on the research and development of key projects such as the new generation 100G single wave product series and the low-power 400G DR4/FR4 product series in 2022, laying a solid foundation for future market layout.

KinKuo, as a high-tech enterprise that represents Amphenol high-speed connectors, integrates sales and services. Its product range is extensive, including various optical communication connectors, high-speed backplane connectors, high-speed storage connectors and cables, and solutions. The product includes SFP+, SFP28, SFP56, SFP112 series, QSFP+, QSFP28, QSFP56, QSFP112, QSFP224 series, OSFP56, OSFP112, OSFP224, OSFP-XD series, QSFP-DD 56G, QSFP-DD 112G, QSFP-DD 224G series, AirMAX high-speed backplane series, CPO, XPO, PCIe, MCIO, GEN_Z, SFF-8654, SFF-8643, SFF-8639 U.2 series.